I worked 6 months for Robert Bosch GmbH (Apr 2011 – Sept 2011) as a simulation engineer trainee during my master studies. My main task was to make thermal and solid structural finite element simulations on acceleration-and gyroscopic sensors in Ansys Workbench / APDL and to investigate the behaviour of MEMS packages. I used Ansys and Matlab for the calculations. I presented the results to Hungarian and to German colleagues.
My simulation tasks:
1. Simulating the gluing process of sensors. Heating up the structure until gluing temperature and then cooling it back to room temperature. Effect of thermal stresses - plastic deformation.
2. Simulating the plastic molding and soldering processes. Heating up the structure first until the molding temperature and then until soldering temperature and finally cooling it back to room temperature.
3. Moisture simulations of MEMS packages
4. Investigation of soldering arrangements of MEMS packages.
5. Investigating the warpage of MEMS packages.
