![](https://s3images.coroflot.com/user_files/individual_files/710021_jrp9qqqdbojn_nyz53koms5a8.jpg)
Pro/Engineer model of upper housing.
![](https://s3images.coroflot.com/user_files/individual_files/710021_9l3uxzm5irrgoiksnr9ntzjdl.jpg)
Pro/Engineer model of upper and lower housings.
![](https://s3images.coroflot.com/user_files/individual_files/710021_3gpurgoeh2engayq0b9grktbp.jpg)
Exploded view of assembly.
![](https://s3images.coroflot.com/user_files/individual_files/710021_w_nvlngorb35ytcowl99gveyt.jpg)
Upper housing and PCBAs.
![](https://s3images.coroflot.com/user_files/individual_files/710021_al_m7tlplsorzzpzb3wipttbu.jpg)
Interior view of upper housing.
![](https://s3images.coroflot.com/user_files/individual_files/710021_m7flhgrvcydufnx43jxxcx9fn.jpg)
Model of board stack with EMI/RFI shielding.
![](https://s3images.coroflot.com/user_files/individual_files/710021_hfmzwwcbzpvfpo8dewklgiexk.jpg)
![](https://s3images.coroflot.com/user_files/individual_files/710021_g9gdku4iqypn2ttx6qlk5b9qt.jpg)
Model of board stack with EMI/RFI shielding.
![](https://s3images.coroflot.com/user_files/individual_files/710021_at5dfaus_9cutmxvsalctmjox.jpg)
Model of board stack with EMI/RFI shielding.
![](https://s3images.coroflot.com/user_files/individual_files/710021_p32rjrtpiwtldzfsxvxisu4ks.jpg)
Early spec drawing for communication with hardware engineers.
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